Wafer Cutting Machine

Wafer Cutting Machine

- It is the machine that performs the cutting process of the wafer blocks, which are formed into blocks after the cream is applied, and then cooled in the specified dimensions.
- It is suitable for precision and high capacity cutting operations.
- For the cutting process, the blocks first pass through the 1st cutting cage and then they are pushed into the 2nd cutting cage at right angles.
- The cutting cages are designed in such a way that they can be easily changed when a change in product dimensions is required.
- Thanks to the automatic product feeding system at the machine entrance, the wafer production process continues untouched.
- Optionally, the double cutting machine, which is a special design, can be used to provide high capacity or to obtain 2 different types of products.
- The area where the wafer cutting is made is covered with a transparent and polycarbonate cover.
- Depending on the final cutting dimensions, the amount of waste generated during the cutting process is at most 5%.
- This corresponds to a shortening of about 5 mm from each side of the wafer block.
- The cut wafers are fed automatically to the separator or conveyor belt.